Volpiano (Italy)
August 06, 2021
SPEA-Goepel | Boundary Scan & In-Circuit Test in our next Webinar
SPEA-Goepel “Boundary Scan & In-Circuit Test. Two proven and complementary test methods combined to reduce cost and enhance defect coverage.”
SPEA in collaboration with Goepel, will be carrying out the webinar “Boundary Scan & In-Circuit Test. Two proven and complementary test methods combined to reduce cost and enhance defect coverage.” on September 28, 2021.
The SPEA and Goepel technicians will be able to deepen the features of the In-Circuit, Boundary Scan and JTAG integrated solutions. The methods and benefits of integrating these techniques will also be examined. The innovation of SPEA machines, applied to Goepel testing technologies, offers significant advantages.
Learn how the combination of two proven and complementary testing techniques, such as Boundary Scan and In-Circuit Test, result in reduced costs and improved defect coverage.
