Shanghai (China)

October 18, 2021

SPEA exhibits its newest technologies at CISES 2021

We really enjoyed participating in the China International Semiconductor Executive Summit in Shanghai. As SPEA continues expanding over the Chinese market through semiconductor activities, it has been a privilege for us being once again part of the world’s largest gathering of senior executives in semiconductor manufacturing.
Our participation in such relevant and focused sessions gives us the opportunity to extend our global network and strengthen our business relationships.

 

We have introduced the most advanced SPEA Analog/Digital/Mixed-signal tester, the DOT800. This machine combines the capabilities of two testers into a single, test-head-only system, giving a true zero-footprint solution. Its innovative device-oriented instrumentation incorporates all the resources for analog, digital and signal processing in a single, powerful, configurable board. Superior test performance comes with a multi-site efficiency >99.5% for a broad range of devices.

Find out more about our DOT800 and its multi-core architecture >