Stuttgart (Germany)
October 11, 2021
SPEA’s Latest Technologies on Show at BondExpo 2021

We want to thank everyone who visited the Opticalbonding booth at the 14th edition of BondExpo in Stuttgart. SPEA is proud to have presented its equipment and solutions in collaboration with SMT World Wide.
Bondexpo was a great occasion for us to explore and meet new markets and this gives us reasons to improve ourselves and develop new routes.
Discover SPEA’s solutions for testing and calibration of Optical Bonding technologies.
Find out how to verify your touch display performances, while saving on the cost of test.